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Date

08 January 2019

Attendees

Goals

Discussion Items

TimeItemWhoNotes
15 minsGeneral Administrative & StatusKarthik Sethuraman
  • Next TAPI call: Next week
    • Jan 29 - MEF Q1, but we will have the call
  • Joint ITU-T SG-15 Q14 & IEEE 802.1 CFM YANG/UML & ONF coordination call for G.8052.1
    • Next monday
10 minsReview: TAPI Work Items and release planKarthik Sethuraman
  •  TAPI SDK release schedule (timefarme based)
    •  2.0.0 - 2018 Jan-start
    •  2.0.1 - 2018 Feb-mid
    •  2.0.2 - 2018 Mar-end
    •  2.1 - 2018 July-end
      •  OTSi Spec Model Updates to include OMS/OTS Media
      •  ETH Spec Model Updates to include OAM
      •  ODU Spec Model; Updates to include OTU
      •  DSR Spec Model
      •  OAM Model Updates to align with MEF NRM-OAM
      •  Notification Model Updates
      •  Equipment/Inventory Model (previously scheduled for 2.2)
      •  OpenAPI updates for RESTConf compliance
    •  2.2
      •  Timeline - 2019 Mar-end (Q1-end)
        •  SNAPSHOTS: Weekly starting Jan 2018 (TAGS)
        •  RC1: 2019 Jan-end (feature freeze)
        •  RC2: 2019 Feb-end
        •  RC3: 2019 Mar-mid
        •  Release: 2019 Mar-end
      •  Work Items
        •  Photonic Model updates
        •  OAM Model Updates
        •  Profiles & Templates
          •  OAM Profile - to support Ethernet PM, thresholds
          •  SLS Profile
        •  Routing Constraints
        •  Resilience Constraints
        •  Node Constraints
        •  Equipment Inventory
        •  ETH Model (non-OAM) Updates
        •  ODU Model Updates
        •  DSR Model Updates
        •  YANG conditional augments
        •  RESTConf/OAS Bugs/Enhancements
        •  Python-Flask Reference Implementation
        •  TAPI Requirements Updates (TR-527)
  •  TAPI Work Items (not release specific - checked means "being worked on")
    •  TAPI Model Refinement/Enhancement
      •  OAM model
      •  Virtual Network model
      •  Notification model
      •  Routing Constraints
      •  Resilience Constraints
    •  TAPI Documentation/Scenarios/Examples
      •  Termination Examples
      •  Multilayer Scenarios
      •  OAM Scenarios
      •  Node Constraints
    •  Technology Spec Model
      •  ODU/OTU
      •  OTSi Media
      •  DSR
      •  Ethernet
      •  Wireless
    •  TAPI Reference Implementation framework
      •  single layer use case
      •  multi-layer symmetric use case
      •  multi-layer asymmetric use case
    •  Equipment Inventory
    •  Equipment configuration
    •  Mgmt of Device Control interfaces
    •  Mgmt of Synchronization/Timing
    •  Mgmt of Software/Firmware download
    •  LTP Specification structure updates/enhancement
75minsEquipment ModelNigel Davis
    • Core IM Equipment Model Overview
    • Equipment Spec Model Details
    • Core IM Connector-Pin-Strand Model Overview
  • Relationship between Equipment/Connector & Access Port
30 minsPhotonic ModelKarthik Sethuraman
  • Continued the discussion on modelling of the MediaChannelAssembly (Group) and MediaChannel (Part) entities (NEP, CEP & Connection)
  • Option 1: Only model MCAssembly NEP, CEP & Connection
    • The individual MC properties are modeled as locally composed ListElements
  • Option 2: Only model the MC NEP, CEP & Connection
    • The fact that NEPs/CEPs/Connections are part of an MCAssembly is captured via an groupId property such that entities belonging to the same assembly will have the same groupId
  • Option 3: Model both MCAssembly & MC NEPs/CEPs/Connections as first class entities (with their own UUIDs) - current TAPI 2.1 approach
    • An MCAssembly NEP/CEP/Connection aggregates references (pointers) to the MC NEPs/CEPs/Connections
    • In case of an MCAssembly of one MC, explicitly providing MCAssembly NEP/CEP/Connection is optional since the MCAssembly NEP/CEP/Connection currently have no explicitly defined photonic properties (other than aggregation of part-references).
      • This can change if we do define some useful photonic properties in MCAssembly NEP/CEP/Connection

Action Items

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