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3. Open Transport Configuration and Control Home
4. TSIM (former OT-IM)
5. TSIM (ex. OT-IM) Call-in Details & Notes
6. 2017-11-21 OT-IM Meeting Notes

Page History

Record the meeting

London Dec. 4 - 8, 2017 meeting (Invited by ITU-T)

• Logistic information: Q14-meeting-info-v5.docx
• Registration: http://doodle.com/poll/wrzpq2txbnhdnyiv
  • Members were reminded to check their registration.
  • Host (Nigel) needs the account of attendees for logistic planning.
• Contribution deadline: Nov. 27, 2017 End of Day (Geneva Time)

2018 Face-to-Face meeting proposal

• Proposed meetings: Face-to-Face Meetings
  • 3 meetings have been planned.
  • The dates of these 3 meeting are pretty firm now because they are selected so to avoid conflict with other SDO meetings.

• Previous discussion
  • 2017-11-14 OT-IM Meeting Notes
• No further updates yet
• Discussion
  • Kam asked for suggestion of example figures of devices (line cards)
    • Bernd: Draft G.8060 Equipment function, WD08 in https://www.itu.int/ifa/t/2009/sg15/exchange/wp3/q9/2011-06-Chicago/wd/wd08-Editors-G.8060-latest-draft.zip
    • Nigel: TMF SD1-18_Layers section 4 has line card figures suitable for TR-512.A.4, A.5, and A.6: Figure 12, Figure 13 PTP, Figure 16, Figure 41,
    • Karthik: Can use some of the TAPI figures, need to be de-tapitized;

• G.8052.1 Ethernet OAM UML & YANG

• • G.8052 v2.04 OAM
    • 
    • The OAM details are in the MepSource/Sink/Bidirectional, ETH_TTPSource/Sink/Birectional, ETH_CTPSource/Sink/Bidirectional, MeasurementJobControl classes
      • These classes will be pruned for the non OAM artifacts

• IEEE 802 YANG

• • CFM
    • uml-lite-cfm:
  • • • • 
        • IEEE YANG models
          • Links of the latest drafts are to be provided
          • 

• Touch point of the G.8052.1 and IEEE OAM models
  • The G.8052.1 Mep and ETH TP are the touch point objects to the IEEE OAM model, in particular to the IEEE MEP and Component classes
  • Three possible approaches for the touch point mechanism
    1. Spec approach: The G.8052.1 Mep and ETH TTP/CTP decorate the IEEE MEP and Component
       
    2. Subclassing approach: The G.8052.1 Mep and ETH TTP/CTP are subclassed from IEEE MEP and Component
    3. Reference approach: The G.8052.1 Mep and ETH TTP/CTP point to the IEEE MEP and Component for the needed properties
• Issues occurring during "re-engineering" of IEEE YANG modules to UML
  • 
  • YANG module name has number directly following a character: ieee802-dot1ag-cfm
    The tool inserts a "-" between characters and numbers: ieee-802-dot1ag-cfm
  • IEEE and IETF YANG modules use the same container name with different properties in augments
    Scott mentioned that this is already known and will be changed
  • Mapping tool maps all object classes into YANG groupings and inserts these groupings via "uses" into container or lists
    The "hand crafted" YANG modules add the properties directly via "leaf"